Trade Fairs and Exhibitions

• Indium Phosphide Compound Semiconductor Wafers (InP)
• Cadmium Zinc Telluride Compound Semiconductor Wafers (CdZnTe)
• YAG Ceramics for Laser Applications
• Magnesium Silicide Single Crystal Wafers for SWIR Sensors (Mg₂Si)

• Mighty Shield^®（3D-formable Sheets for Electromagnetic Shielding）
• Hybrid Shield
• Rolled copper foil for battery management system

• Sputtering Targets for Semiconductors
• Sputtering Targets for Lead-Free Piezoelectric Devices

December 9, 12:00 - 17:00
10, 9:00 - 17:00
11, 9:00 - 12:00

• IEDM 2024 will be held from December 7-11, 2024, and our booth opening dates are listed above.

• Sputtering Targets for Semiconductors
• Upinorg (High-Purity Copper Sulfate)
• Surface Treatment Agents
• Low α High-Purity Metals
• Electroless UBM plating service
• CVD・ALD Precursor Materials

• Panel exhibit only.

• Coated Copper Powder for Additive Manufacturing
  For L-PBF (New Product)
  For EBM

• Mighty Shield^®（3D-formable Sheets for Electromagnetic Shielding）
• Sn-Cu-PET Foil for Electromagnetic Shielding
• High Strength Copper Alloy for Connectors
• Copper Foils for Flexible Printed Circuits
• High-strength Copper Foils for Li-Ion Battery

• Mighty Shield^®（3D-formable Sheets for Electromagnetic Shielding）
• Hybrid Shield
• Rolled Copper Foil for Battery Management System

• Indium Phosphide Compound Semiconductor Wafers (InP)
• YAG Ceramics for Laser Applications
• Magnesium Silicide Single Crystal for Infrared Detector (Mg₂Si)
• Strontium Titanate (SrTiO₃)
• Rutile Titanium Dioxide (TiO₂)

• Mighty Shield^®（3D-formable Sheets for Electromagnetic Shielding）
• Hybrid Shield

• Magnesium Silicide Single Crystal for Infrared Detector (Mg₂Si)
• Cadmium Zinc Telluride Compound Semiconductor Wafers (CdZnTe)
• Indium Phosphide Compound Semiconductor Wafers (InP)

• Indium Phosphide Compound Semiconductor Substrates (InP)
• YAG Ceramics for Laser Applications
• 3D-formable Sheets for Electromagnetic Shielding（Mighty Shield^®）
• High Strength Titanium Copper Alloys

• Mighty Shield^®(3D-formable Sheets for Electromagnetic Shielding）
• Copper Foils for Flexible Printed Circuits (FPC)
• Extremely High Strength Copper Titanium Foils for Auto-focus Camera Module
• High Strength and High Electrical Conductivity Corson Alloy Foils for Small Connector
• High Strength Rolled Copper Foils for Li-ion Battery

• Indium Phosphide Compound Semiconductor Substrates (InP)
• YAG Ceramics for Laser Applications
• Magnesium Silicide Single Crystal for Infrared Detector (Mg₂Si)
• Strontium Titanate (SrTiO₃)
• Rutile Titanium Dioxide (TiO₂)

• EMC Shielding for Mighty Shield^Ⓡ

• Click here for exhibition details

• EMC Shielding for Mighty Shield^®
• Hybrid shield

• Click here for exhibition details

• We will exhibit various high-performance copper alloys that contribute to the advancement of telecommunications and mobility, as well as compound semiconductors, Niobium precursors for battery applications, and other metallic and ceramic materials that contribute to the realization of a sustainable society.
• We will display also copper ink for fine lines with printed electronics, photocatalyst for artificial photosynthesis, and magnetocaloric spheres for hydrogen liquefaction magnetic refrigerator.
• We will exhibit our initiatives for sustainable copper supply and recycling, and our efforts to realize a circular economy, such as recycling technology for recovering high-purity metallic salts from discarded vehicle Li-ion batteries.

• 3D formable sheet for EMI shielding
• Sn-Cu-PET foil for EMI shielding
• Copper foil for Li-ion Battery (HS1200)
• Copper foil for FPC in Battery management system (HA & HA-V2)

• Click here for exhibition details

• 3D Formable EMI shielding sheet
• Hybrid shield
• Tin-plated Copper Foil for Electromagnetic Shielding

• Click here for exhibition details

• JX Advanced Metals’s Efforts to Achieve Circular Economy
• Sustainable Copper Vision
• Green-hybrid Smelting
• Recycling of Valuable Metals from Various Types of Scrap

• Click here for exhibition details

• Compound Semiconductor Substrates -InP, CdZnTe-
• YAG Ceramics for Laser Applications
• Mg₂Si Single Crystal for Infrared Detector
• Strontium Titanate (SrTiO₃)
• Rutile Titanium Dioxide (TiO₂)

• Click here for exhibition details

• High-strength copper alloy - Titanium Copper
• Copper materials for high-frequency and high-speed transmission
• Electromagnetic shielding materials
• High-strength copper foils for Li-Ion battery

• See more

We presented a range of products developed in-house, including some exhibited for the first time, such as Corson alloys combining high conductivity with high strength and 3D formable sheet for electromagnetic shielding. We also displayed various metal and ceramic materials including rolled copper foil and sputtering targets. The exhibits were organized according to themes such as "proposals for dealing with heat" and "metal powders for additive manufacturing."

• This was a joint exhibit with JX Metals Trading, TANIOBIS, Toho Titanium, and Tatsuta Electric Wire & Cable