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MoSi
2
Heater
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Copper Alloys and Special Steel Products
Copper Alloys and Special Steel Products
Copper Alloy Strip
Hyper Phosphor Bronze
Titanium Copper Alloy
Corson Alloys
Phosphor Bronze
Nickel Silver
High Conductivity Alloys
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Copper Alloy Foil
HS1200
Sn-Cu-PET foil for electromagnetic shielding
C1990HP Foil (Titanium Copper Foil)
Special Steel Products
Copper Foil
Copper Foil
Treated Rolled Copper Foil
JXEFL Series Electro-Deposited Copper Foil for Flexible Printed Circuits
Copper Foil for Rigid Circuit Boards
Precision Fabrication on Consignment
Precision Fabrication on Consignment
Precision Stamping and Plating
Sputtering Targets
Sputtering Targets
What Is Sputtering?
Sputtering Targets for Semiconductors
AlSc Sputtering Target
Sputtering Targets for Flat Panel Displays
Sputtering Targets for Optical Films
Sputtering Targets for Magnetic Devices
Sputtering Targets for Photovoltaic Cells
Compound Semiconductors and Crystal Materials
Compound Semiconductors and Crystal Materials
Compound Semiconductor Substrates-InP, CdZnTe (CdTe)-
Strontium Titanate (SrTiO
3
)
Rutile Titanium Dioxide (TiO
2
)
Magnesium silicide (Mg
2
Si) Single Crystal for Infrared Detector
Metal and Compound Powders
Metal and Compound Powders
Tantalum and Niobium Materials
High Purity Chlorides
Metal Powders for Additive Manufacturing
Other Metal Powders
Special Ceramic Powders
Special Ceramic Powders
Negative Thermal Expansion Material ZrW
2
O
8
High Purity Metals
High Purity Metals
High Purity Metals
Low α Tin
Surface Treatment Agents
Upinorg (high-purity copper sulfate)
Electroless UBM Plating Service
MoSi
2
Heater
Shielding Materials
Shielding Materials
3D formable Sheets for Electromagnetic Shielding
Sn-Cu-PET foil for electromagnetic shielding
Nonferrous Metals and Chemical Products
Nonferrous Metals and Chemical Products
Refined Copper/Copper Cakes and Billets
Precious Metals
Rare Metals
Sulfuric acid, slag, gypsum, etc.
Products Under Development
Products Under Development
Special Ceramic Powders
3D formable Sheets for Electromagnetic Shielding
Metal Powders for Additive Manufacturing
High Purity Chlorides
Lead-free Piezoelectric Powder Material
AlSc Sputtering Target
YAG Ceramics for Laser Applications
Magnesium silicide (Mg
2
Si) Single Crystal for Infrared Detector
Semiconductors and Sensors
Semiconductors and Sensors
For Front-end (Wafer) Processes
Sputtering Targets for Semiconductors
AlSc Sputtering Target
Sputtering Targets for Magnetic Devices
Sputtering Targets for Optical Films
High Purity Chlorides
Lead-free Piezoelectric Powder Material
Tantalum and Niobium Materials
For Back-end (Assembly) Processes
Copper Alloys for Lead Frames
Surface Treatment Agents
Upinorg (high-purity copper sulfate)
Electroless UBM Plating Service
Low α Tin
Circuit Boards
Circuit Boards
Copper Foil
Surface Treatment Agents
Upinorg (high-purity copper sulfate)
Precision Stamping and Plating
Tantalum and Niobium Materials
Negative Thermal Expansion Material ZrW
2
O
8
Low α Tin
High Strength Copper Alloys for Sockets
Assembly
Assembly
Negative Thermal Expansion Material ZrW
2
O
8
High Purity Metals
Tantalum and Niobium Materials
Low α Tin
Electroless UBM Plating Service
Displays
Displays
Sputtering Targets for Flat Panel Displays
Sputtering Targets for Optical Films
Batteries and Energy
Batteries and Energy
HS1200
Sputtering Targets for Photovoltaic Cells
Compound Semiconductor Substrates-InP, CdZnTe (CdTe)-
Strontium Titanate (SrTiO
3
)
Rutile Titanium Dioxide (TiO
2
)
Tantalum and Niobium Materials
High Purity Chlorides
Additive Manufacturing
Additive Manufacturing
Metal Powders for Additive Manufacturing
Connectors
Connectors
Copper Alloys for Board to Board Connectors
Copper Alloys for FPC Connectors
Copper Alloys for Backplane Connectors
Alloys for Floating Connectors
Copper Alloys for SIM Card Connectors
Copper Alloys for USB Connectors
Copper Alloys for Harness Connectors
Precision Stamping and Plating
Surface Treatment Agents
Magnetic Devices
Magnetic Devices
Sputtering Targets for Magnetic Devices
Electromagnetic Shielding
Electromagnetic Shielding
Sn-Cu-PET foil for electromagnetic shielding
3D formable Sheets for Electromagnetic Shielding
Communications
Communications
Surface Treatment
AlSc Sputtering Target
Compound Semiconductor Substrates-InP, CdZnTe (CdTe)-
Strontium Titanate (SrTiO
3
)
Rutile Titanium Dioxide (TiO
2
)
Tantalum and Niobium Materials
Optics
Optics
Sputtering Targets for Optical Films
Compound Semiconductor Substrates-InP, CdZnTe (CdTe)-
Strontium Titanate (SrTiO
3
)
Rutile Titanium Dioxide (TiO
2
)
YAG Ceramics for Laser Applications
Tantalum and Niobium Materials
High Purity Chlorides
Magnesium silicide (Mg
2
Si) Single Crystal for Infrared Detector
Camera Modules
Camera Modules
Titanium Copper Alloy
Sputtering Targets for Optical Films
High Purity Chlorides
Piezoelectricity
Piezoelectricity
AlSc Sputtering Target
Lead-free Piezoelectric Powder Material
Thermal Control
Thermal Control
Copper Alloys for Cooling Modules
Negative Thermal Expansion Material ZrW
2
O
8
MoSi
2
Heater
