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Products and Services

Semiconductors and Sensors
For Front-end (Wafer) Processes
For Back-end (Assembly) Processes

Connectors
- Copper Alloys for Board to Board Connectors
- Copper Alloys for FPC Connectors
- Copper Alloys for Backplane Connectors
- Alloys for Floating Connectors
- Copper Alloys for SIM Card Connectors
- Copper Alloys for USB Connectors
- Copper Alloys for Harness Connectors
- Precision Stamping and Plating
- Surface Treatment Agents

Optics
- Sputtering Targets for Optical Films
- Compound Semiconductor Substrates-InP, CdZnTe (CdTe)-
- Strontium Titanate (SrTiO3)
- Rutile Titanium Dioxide (TiO2)
- YAG Ceramics for Laser Applications
- Tantalum and Niobium Materials
- High Purity Chlorides
- Magnesium silicide (Mg2Si) Single Crystal for Infrared Detector