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Shielding Materials

Under Development3D Formable Sheets for EMI Shielding (Mighty Shield®)

Features of Electromagnetic Shielding Sheet (Mighty Shield®)

  • It is a very lightweight shielding sheet composed of a composite material made of resin film and copper foil.
  • It can shield noise across a wide range of frequency bands.
  • It can be molded into various shapes and cover the entire noise source without gaps.
  • Due to the thermal conductivity of copper, it exhibits high heat dissipation performance.

Typical Applications

  • Noise shielding accompanying the resinification of inverter enclosures
  • Noise shielding for drone control boards

Ultra-lightweight shielding material with an excellent balance of shielding performance and formability

  • Shielding performance
  • Shape flexibility
  • Lightweight
Material Applicable lower frequency limit※
Aluminum 10kHz
Mighty Shield® 100kHz
Iron 1MHz
Plating 10MHz
- 100MHz
Carbon Filler ≧1GHz
  • ※Frequency at which the magnetic shield effect exceeds 20dB according to the KEC method.

【Assumptions for Comparison with Competing Products】

  • MightyShield® is assumed to be an integrally molded sample with PBT-GF30%.
  • The drawing depth of the plating and filler is assumed to be the same as that of Mighty Shield®.
  • The drawing depth of Fe, Al, and Mighty Shield® is compared using 0.4mm sheets.
  • The values for formability and shielding performance are normalized by the unit weight of 3mm thick sheets.

Electromagnetic Shielding Performance

Shielding measurement results for the sheet

It exhibits a magnetic shield effect of over 30dB in frequency bands above 500kHz.

Formability

It can be formed into various shapes while maintaining its shielding function.
It can also be integrally molded by insert molding.

Lightweight

Weight reduction is possible compared to metal plates.

heat dissipation

Mighty Shield® disperse heat quickly to prevent localized heat buildup.

※Measure the Tc temperature when the Tj temperature is maintained at 100°C.
Measurement method

Apply a constant power and measure the temperature at each measurement point. Calculate the thermal resistance from the chip to the external environment based on the measured temperatures.

  • ※Thermal resistance measurement in a still air box environment compliant with JEDEC standards.
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