Trade Fairs and Exhibitions

You can see the trade fairs and exhibitions information JX Metals plans to take part in.

InP substrates
A Mg₂Si wafer of diameter 48 mm
Timing January 30 – February 1, 2024
City/Country San Francisco / United States
Venue The Moscone Center
Description of exhibits
  • Indium Phosphide Compound Semiconductor Substrates (InP)
  • YAG Ceramics for Laser Applications
  • Magnesium Silicide Single Crystal for Infrared Detector (Mg₂Si)
  • Strontium Titanate (SrTiO₃)
  • Rutile Titanium Dioxide (TiO₂)
Other Click here for exhibition details
Mighty Shield(3D Formable Sheets for EMI Shielding)
Applicable for Plastic Housing by Insert Molding
On-board Shielding Case by Drawing
Timing January 24-26, 2024
City/Country Tokyo / Japan
Venue TTokyo Big Sight
Booth number E42-32
Description of exhibits
  • EMC Shielding for Mighty Shield
Timing October 25-27, 2023
City/Country Nagoya / Japan
Venue Port Messe Nagoya
Booth number 10-25
Description of exhibits
  • EMC Shielding for Mighty Shield®
  • Hybrid shield
Timing October 4-6, 2023
City/Country Chiba / Japan
Venue Makuhari Messe Hall 6 Booth number 38-59
Description of exhibits
  • We will exhibit various high-performance copper alloys that contribute to the advancement of telecommunications and mobility, as well as compound semiconductors, Niobium precursors for battery applications, and other metallic and ceramic materials that contribute to the realization of a sustainable society.
  • We will display also copper ink for fine lines with printed electronics, photocatalyst for artificial photosynthesis, and magnetocaloric spheres for hydrogen liquefaction magnetic refrigerator.
  • We will exhibit our initiatives for sustainable copper supply and recycling, and our efforts to realize a circular economy, such as recycling technology for recovering high-purity metallic salts from discarded vehicle Li-ion batteries.
Other Online Exhibition Special Site is Here
Timing September 5-10, 2023
City/Country Munich / Germany
Venue Messe München
Hall B1.B40
Description of exhibits
  • 3D formable sheet for EMI shielding
  • Sn-Cu-PET foil for EMI shielding
  • Copper foil for Li-ion Battery (HS1200)
  • Copper foil for FPC in Battery management system (HA & HA-V2)
Timing July 26-28, 2023
City/Country Tokyo / Japan
Venue Tokyo Big Sight East Hall
Booth number 2H-11
Description of exhibits
  • 3D Formable EMI shielding sheet
  • Hybrid shield
  • Tin-plated Copper Foil for Electromagnetic Shielding
Timing June 28-29, 2023
City/Country Frankfurt / Germany
Venue Frankfurt Messe
Stand: 210
Description of exhibits
  • JX Metals’s Efforts to Achieve Circular Economy
  • Sustainable Copper Vision
  • Green-hybrid Smelting
  • Recycling of Valuable Metals from Various Types of Scrap
Timing June 27-30, 2023
City/Country München / Germany
Venue Messe München
Hall B1.126.1
Description of exhibits
  • Compound Semiconductor Substrates -InP, CdZnTe-
  • YAG Ceramics for Laser Applications
  • Mg2Si Single Crystal for Infrared Detector
  • Strontium Titanate (SrTiO3)
  • Rutile Titanium Dioxide (TiO2)
Timing November 9-12, 2020
Online event
Description of exhibits
  • High-strength copper alloy - Titanium Copper
  • Copper materials for high-frequency and high-speed transmission
  • Electromagnetic shielding materials
  • High-strength copper foils for Li-Ion battery
Timing December 4-6, 2019
City/Country Chiba, Japan
Venue Makuhari Messe International Exhibition Hall 3, 15-56
Description of exhibits

We presented a range of products developed in-house, including some exhibited for the first time, such as Corson alloys combining high conductivity with high strength and 3D formable sheet for electromagnetic shielding. We also displayed various metal and ceramic materials including rolled copper foil and sputtering targets. The exhibits were organized according to themes such as "proposals for dealing with heat" and "metal powders for additive manufacturing."

  • This was a joint exhibit with JX Metals Trading, TANIOBIS, Toho Titanium, and Tatsuta Electric Wire & Cable