News Release

JX Advanced Metals Corporation (President: Hayashi Yoichi; hereinafter "the Company") hereby announces that it has decided to make a capital investment of approximately 4 billion yen to expand the processing capacity for semiconductor sputtering targets at JX Advanced Metals Korea Co., Ltd. (Representative Director: Takamasa Maekawa; hereinafter "JX Advanced Metals Korea"), the Group's base in South Korea.

　

The Group's semiconductor sputtering targets are used in the manufacture of a wide range of semiconductor devices, including cutting-edge logic and advanced memory such as HBM and 3D-NAND, and hold the top share in the industry.
JX Advanced Metals Korea is responsible for the downstream (processing) stage of semiconductor sputtering targets in South Korea, a hub of the advanced semiconductor industry. With co-located sales and technical support functions, it delivers agile proposals and stable supply from a location close to customers, and has contributed to the development of South Korea's electronics industry for many years. In South Korea, the expansion of the semiconductor market, especially for cutting-edge memory, is speeding up significantly. As a result, the role of JX Advanced Metals Korea is becoming increasingly important.
Against this business backdrop, the Company has now decided to expand the processing capacity at this base in order to reliably meet growing demand and strengthen the stable supply system for customers. Through this investment, JX Advanced Metals Korea will introduce automated processing machines that it has cultivated through our business activities and demonstrated across its various sites, and will develop the associated equipment in an integrated manner, with operations scheduled to start in phases from the second half of fiscal 2027. As a result, the processing capacity at this base will approximately double compared to fiscal 2025.
In addition, medium- to long-term growth of the advanced semiconductor industry is anticipated in South Korea, and the Company will consider further expansion of processing capacity while taking future demand trends into account.

　

In June 2026, the Group announced an investment to automate the processing line for the same product at its base in Taiwan^*1. The Group has also set out a policy to expand the processing capacity for the same product at its base in Arizona, USA, in line with demand trends^*2. In Japan, the Group is proceeding with the enhancement of production facilities at the Hitachinaka Thin-Film Materials Plant (Hitachinaka City, Ibaraki Prefecture)^*3. The Company will continue to strengthen its integrated supply chain from raw material procurement through recycling, and will reinforce its supply capabilities by accurately capturing rising demand across semiconductor industry hubs worldwide, thereby living up to the trust of its customers.

　

Going forward, under the 2040 JX Advanced Metals Group Long-Term Vision, the Group will continue to contribute to the development and innovation of society through the stable supply of advanced materials that support the evolution of advanced technologies, including semiconductors.

　

<Reference>
* 1  For details, please refer to the news release dated June 1, 2026, "Automation Investment in Semiconductor Sputtering Target Processing Line at Nikko Metals Taiwan"
* 2  For details, please refer to the news release dated November 25, 2024, "JX Advanced Metals USA, Inc. Celebrates Grand Opening of New Plant in Mesa, Arizona"
* 3  For details, please refer to the news release dated March 10, 2026, "Notice Regarding Capital Investment for Expanding Production of Sputtering Targets for Semiconductors at New Hitachinaka Factory (Acquisition of Fixed Assets)"
 

　

JX Advanced Metals Korea

　

Overview of JX Advanced Metals Korea Co., Ltd. (as of July 23, 2026)

Company name	JX Advanced Metals Korea Co., Ltd.
Location	54 Hansan-ro, Cheongbuk-myeon, Pyeongtaek-si, Gyeonggi-do, Republic of Korea
Representative director	Takamasa Maekawa
Capital	2,400 million won
Business	Processing and sales of sputtering targets