Compound Semiconductors and Crystal Materials

InP Substrates

InP Substrates

JX Advanced Metals products with their consistently high quality are winning customer acclaim and confidence.
We manufacture InP for III-V compound semiconductors. We supply products meeting the latest demand and product requirements.

Product name InP (indium phosphide)Substrates
Primary Applications Light emitting elements, light receiving elements, high-speed electronic devices, infrared detectors, etc.

Lineup

  Size Orientation Dopant
InP Substrates 2inch
3inch
4inch
(100) S, Sn, Zn, Fe, None

Application Examples

Optical Modules

Optical Modules
(Light Emitting Elements, Light Receiving Elements)

Mobile Base Stations

Mobile Base Stations

Data Centers

Data Centers

Proposals for new applications

High-performance collision prevention sensor made feasible

Features

High machining accuracy

  • For improved device quality, we provide substrates with high processing precision.
High machining accuracy
Flatness Map of 4-inch InP Substrate
TTV (Total Thickness Variation) : 1.5µm

Low dislocation defect density

  • With our crystal growth optimization technology, we are able to achieve low dislocation defect density in large substrates.

TOP

低転位の欠陥密度を実現

Avg. 37 cm-2
Max. 664 cm-2

Bottom

Avg. 15 cm-2
Max. 581 cm-2

EPD map of 4-inch S-doped InP substrate

Morphology after epitaxial growth

  • Optimizing the surface orientation of our substrates contributes to epitaxial growth with excellent surface treatment uniformity.
Morphology after epitaxial growth
InGaAs 0.05 μm
InP 2.1 μm
InGaAs 4.0 μm
InP 2.0 μm
S-InP Sub.

Technology for preventing substrate chipping after processing

  • Special edge treatment on our substrates can reduce substrate breakage and chipping in device manufacturing processes.
=Special edge treatment on our substrates can reduce substrate breakage and chipping in device manufacturing processes.

Conventional processing

=Special edge treatment on our substrates can reduce substrate breakage and chipping in device manufacturing processes.

New technology processing

Microscope image of substrate edge

Reduction of surface impurities on the substrates

  • Optimizing the substrate surface treatment contributes to reducing impurities (Si, C) on the substrate and interface after epitaxial growth.

Conventional substrate

Reduction of surface impurities on the substrates

Improved substrate

Reduction of surface impurities on the substrates

SIMS Depth Profile After Epitaxial Growth

Contact Information
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