Copper Foil and Copper Alloy
Electro-deposited Copper Foil
Product Lineup
JXEFL -Electro-deposited copper foil for FPC
- An annealable copper foil with high-elongation Top class of bendability as electro-deposited copper.
- Fine nodulation on the smooth surface of the base foil
- Excellent peel strength with the base film despite the low roughness.
- Various thicknesses
- BHM surface treatment can be applied for high frequency use.
JTCS-P1・JDLC・HLP-Ⅱ -Copper Foil for Rigid Circuit Boards
Low-profile foil very suitable to fine line application.
Available as either roll foil or sheet foil.
- JTCS-P1
- High temperature elongation electro-deposited copper foil (IPC Grade 3)
High peel strength with resin substrates for multilayer boards.
- JDLC
- Superior dimensional stability (IPC Grade 1)
High peel strength with substrates for semiconductor packages.
- HLP-II
- Smooth electro-deposited copper foil (IPC Grade 10)
Excellent fine-pitch etching properties for HDI substrates and module substrates.
Contact Information
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