Copper Foil
JXEFL ― Electro-deposited copper foil for FPC
Features
- An annealable copper foil with high-elongation Top class of bendability as electro-deposited copper.
- Fine nodulation on the smooth surface of the base foil
- Excellent peel strength with the base film despite the low roughness.
- Various thicknesses
- BHM surface treatment can be applied for high frequency use.
Applications
- Flexible printed circuits (FPC)
Typical properties
| Product | Thickness | Tensile strength | Elongation (room temperature) |
Surface roughness : Rz |
| μm | MPa | % | μm | |
| JXEFL-V2 | 9 | 370 | 5 | 1.7 |
| 12 | 410 | 10 | 1.7 | |
| 18 | 390 | 15 | 1.7 | |
| 25 | 390 | 18 | 1.7 | |
| 35 | 390 | 20 | 1.7 | |
| 45 | 380 | 22 | 1.7 | |
| 50 | 370 | 23 | 1.7 | |
| 70 | 350 | 25 | 1.7 | |
| JXEFL-BHM | 12 | 410 | 10 | 1.3 |
| 18 | 390 | 15 | 1.3 |
Contact Information
From the Web
Inquiries accepted 24 hours a day.