Copper Foil
Copper Foil for Rigid Circuit Boards
JTCS-P1・JDLC・HLP-II
Features
Low-profile foil very suitable to fine line application.
Available as either roll foil or sheet foil.
- JTCS-P1
- High temperature elongation electro-deposited copper foil (IPC Grade 3)
High peel strength with resin substrates for multilayer boards.
- JDLC
- Superior dimensional stability (IPC Grade 1)
High peel strength with substrates for semiconductor packages.
- HLP-II
- Smooth electro-deposited copper foil (IPC Grade 10)
Excellent fine-pitch etching properties for HDI substrates and module substrates.
Applications
- High Density Interconnect (HDI) boards
- IC package substrates
- Multi-layer printed circuit boards
- Module substrates
Typical properties
| Product | Thickness | Tensile strength | Elongation | Surface roughness : Rz |
| μm | MPa | % | μm | |
| JTCS-P1 | 5 | 390 | 2 | 1.8 |
| 9 | 390 | 4 | 3.0 | |
| 12 | 390 | 8 | 3.5 | |
| 18 | 390 | 12 | 4.0 | |
| JDLC | 12 | 400 | 7 | 3.2 |
| HLP-II | 12 | 350 | 11 | 1.3 |
CAC (Copper-Aluminum-Copper) Foil
- Copper foil attached to an aluminum shield by a peelable adhesive.
- Available with the copper foil attached either on one side or on both sides of the aluminum separator.
Features
- Contribute to higher yield by preventing contaminants causing denting or wrinkling during lay-up.
- More layers can be laid up comparing with stainless steel plate, thereby providing process cost savings.
Applications
- Printed circuit boards (mainly multi-layer boards)
Contact Information
From the Web
Inquiries accepted 24 hours a day.