Treated Rolled Copper Foil

This is our standard rolled copper foil, with good flexibility and vibration resistance properties.

• It is widely utilized in flexible printed circuits products.
• Surface treatment is applied to enhance adhesion performance and resistance to heat, acid, and rust.
• The surface roughness is lower than electro-deposited copper foil.

The properties of HA/HA-V2 foil are dramatically improved compared with ordinary rolled copper foil through adjustments to the grain size and crystallographic orientation.

• Outstanding flexibility minimizes cracking.
• Dramatic improvement in vibration resistance.
• High pliability due to low repulsive force.

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Recrystallized fine grain for better fine pitch wiring.

• Excellent circuit linearity and affinity for soft-etching patterning.
• Even with thin foil, the high stiffness after annealing ensures excellent handling property.
• Homogeneous and high elongation without necking, resulting in superior bend formability.

Various kinds of surface treatment are available to meet customer's needs.

• Fine and low roughness treatment achieves better adhesion property to resin.
• Treatments are highly evaluated related with requirements for high frequency or fine patterning.
• A variety of rust-proofing treatments achieve outstanding resistance to heat, chemicals, and soldering.

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We provide the optimal copper foil to meet all kinds of customer's needs, with a wide range of treated rolled copper foil from 6 µm (under development) to 150 µm.

The flexibility and stability of treated rolled copper foil makes it suitable for FPC products, which requires high reliability.