Compound Semiconductors and Crystal Materials

InP Substrates

InP Substrates

JX Advanced Metals products with their consistently high quality are winning customer acclaim and confidence.
We manufacture InP for III-V compound semiconductors. We supply products meeting the latest demand and product requirements.

Product name InP (indium phosphide)Substrates
Primary Applications Light emitting elements, light receiving elements, high-speed electronic devices, infrared detectors, etc.

Lineup

  Size Orientation Dopant
InP Substrates 2inch
3inch
4inch
(100) S, Sn, Zn, Fe, None

Application Examples

Mobile Base Stations

Mobile Base Stations

Data Centers

Data Centers

Optical Modules

Optical Modules
(Light Emitting Elements, Light Receiving Elements)

Solar Power

Solar Power

Proposals for new InP applications

High-performance collision prevention sensor made feasible

Laser radar at eye-safe wavelength made feasible
 

Features of InP Substrates

  • We have long been providing InP substrates as essential materials for light emitting and receiving elements in optical communications.

High machining accuracy

  • For improved device quality, we provide substrates with high processing precision.
High machining accuracy
TTV:1.5µm(4” InP substrate)
Total Thickness Variation

Low dislocation defect density

  • With our crystal growth optimization technology, we are able to achieve low dislocation defect density in large substrates.

TOP

低転位の欠陥密度を実現

Avg. 37 cm-2
Max. 664 cm-2

Bottom

Avg. 15 cm-2
Max. 581 cm-2

EPD map of 4-inch S-doped InP substrate

Morphology after epitaxial growth

  • Optimizing the surface orientation of our substrates contributes to their excellent surface uniformity following epitaxial growth.
Morphology after epitaxial growth
InGaAs 0.05 μm
InP 2.1 μm
InGaAs 4.0 μm
InP 2.0 μm
S-InP Sub.

Technology for preventing substrate chipping after processing

  • Special edge treatment on our substrates can reduce substrate breakage and chipping in device manufacturing processes.
=Special edge treatment on our substrates can reduce substrate breakage and chipping in device manufacturing processes.

Conventional processing

=Special edge treatment on our substrates can reduce substrate breakage and chipping in device manufacturing processes.

New processing technology

Electron microscope cross-sectional image

Reduction of surface impurities on the substrates

Conventional substrate

Reduction of surface impurities on the substrates

Improved substrate

Reduction of surface impurities on the substrates
Contact Information
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