Copper Foil

Treated Rolled Copper Foil

Product Lineup

TPC foil (tough pitch copper foil)

This is our standard rolled copper foil, with good flexibility and vibration resistance properties.

  • It is widely utilized in flexible printed circuits products.
  • Surface treatment is applied to enhance adhesion performance and resistance to heat, acid, and rust.
  • The surface roughness is lower than electro-deposited copper foil.

The properties of HA/HA-V2 foil are dramatically improved compared with ordinary rolled copper foil through adjustments to the grain size and crystallographic orientation.

  • Outstanding flexibility minimizes cracking.
  • Dramatic improvement in vibration resistance.
  • High pliability due to low repulsive force.

HG foil

Recrystallized fine grain for better fine pitch wiring.

  • Excellent circuit linearity and affinity for soft-etching patterning.
  • Excellent handling ability due to high stiffness regardless of the foil's thinness.
  • High elongation property due to homogeneous deformation without constriction, resulting in superior bendability.

Various kinds of surface treatment are available to meet customer's needs.

  • Fine and low roughness treatment achieves better adhesion property to resin.
  • Treatments are highly evaluated related with requirements for high frequency or fine patterning.
  • A variety of rust-proofing treatments achieve outstanding resistance to heat, chemicals, and soldering.

Treated Rolled Copper Foil Lineup and Typical Properties

Treated rolled copper foil lineup

We provide the optimal copper foil to meet all kinds of customer's needs, with a wide range of treated rolled copper foil from 6 µm (under development) to 150 µm.

Foil Products

Grade Type Features Purity Thickness (µm)
150 105 70 35 18 12 9 6
High functionality HA-V2 (OFC) High flexibility
Low repulsive force
Ease of handling
Cu: At least 99.9%
Ag:100ppm
HA (TPC) High flexibility
Low modulus of elasticity
Cu: At least 99.9%
Ag:190ppm
         
HG (OFC) High flexibility
Circuit linearity
Soft-etching patterning property
Cu: At least 99.9%            
General TPC
(tough pitch copper)
JIS:C1100
General Cu: At least 99.9%        

Typical properties

The flexibility and stability of treated rolled copper foil makes it suitable for FPC products, which requires high reliability.

Physical properties

Type BHY-T BHYX-HA GHY5-HA GHY5-HA-V2
IPC Grade Grade 8 (LTA-W)
Modulus of elasticity
(GPa)
(resonance method)
Before annealing MD 105 122 122 110
TD 120 140 140 140
After annealing
(180℃/1h)
MD 105 76 76 85
TD 100 76 76 85
Electrical conductivity (% IACS) 100 100 100 101
Resistivity (ohm-gram/m2) 0.154 0.154 0.154 0.153

Mechanical properties

Type BHY-T BHYX-HA GHY5-HA GHY5-HA-V2
IPC Grade Grade 8 (LTA-W)
Hardness
(Hv)
Before annealing Vickers 106 100 113 125
After annealing
(180℃/1hr)
58 40 48 46
Tensile strength
(MPa)
Before annealing MD 440 500 500 500
TD 420 510 510 505
at 180℃ MD 193 211 236 310
TD 157 89 110 296
After annealing
(180℃/1h)
MD 210 145 145 150
TD 160 120 120 125
Elongation
(%)
Before annealing MD 1 2 2 2
TD 1 3 3 2
at 180℃ MD 2 1 1 1
TD 2 1 1 1
After annealing
(180℃/1h)
MD 10 8 8 8
TD 6 4 4 5
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