Copper Foil

Copper Foil for Rigid Circuit Boards

JTCSLC and JDLC

Features

Low-profile foil very suitable to fine line application.
Available as either roll foil or sheet foil.

JTCSLC
Fine nodulation and low surface roughness
High peel strength and excellent thermal resistance
JDLC
High reliability for semiconductor package substrate material
Superior dimensional stability
Excellent etching factor

Applications

  • High Density Interconnect (HDI) boards
  • IC package substrates
  • Multi-layer printed circuit boards

Typical properties

Product Thickness Tensile strength Elongation (room temperature) Peel strength (FR-4)
µm Mpa % kN/m
JTCSLC 9 390 4 1.0
12 390 8 1.2
18 390 12 1.4
JDLC 12 400 6 1.1

CAC (Copper-Aluminum-Copper) Foil

  • Copper foil attached to an aluminum shield by a peelable adhesive.
  • Available with the copper foil attached either on one side or on both sides of the aluminum separator.

Features

  • Contribute to higher yield by preventing contaminants causing denting or wrinkling during lay-up.
  • More layers can be laid up comparing with stainless steel plate, thereby providing process cost savings.

Applications

  • Printed circuit boards (mainly multi-layer boards)
Contact Information
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