Copper Foil
JXEFL ― Electro-deposited copper foil for FPC
Features
- An annealable copper foil with high-elongation Top class of bendability as electro-deposited copper.
- Fine nodulation on the smooth surface of the base foil
Excellent peel strength with the base film despite the low roughness. - Various thicknesses
- BHM or FX surface treatment can be applied for high frequency use.
Applications
- Flexible printed circuits (FPC)
Typical properties
| Product | Thickness | Tensile strength | Elongation (room temperature) |
Peel strength |
| µm | kg/mm2 | % | kN/m | |
| JXEFL-V2 | 9 | 42 | 6 | 0.7 |
| 12 | 42 | 8 | 0.8 | |
| 18 | 42 | 14 | 1.0 | |
| 25 | 41 | 20 | 1.1 | |
| 35 | 40 | 20 | 1.3 | |
| 45 | 39 | 22 | 1.4 | |
| 50 | 38 | 22 | 1.6 | |
| 70 | 36 | 27 | 1.7 |
Contact Information
From the Web
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