Copper Foil
Copper Foil for Rigid Circuit Boards
JTCSLC and JDLC
Features
Low-profile foil very suitable to fine line application.
Available as either roll foil or sheet foil.
- JTCSLC
- Fine nodulation and low surface roughness
High peel strength and excellent thermal resistance
- JDLC
- High reliability for semiconductor package substrate material
Superior dimensional stability
Excellent etching factor
Applications
- High Density Interconnect (HDI) boards
- IC package substrates
- Multi-layer printed circuit boards
Typical properties
| Product | Thickness | Tensile strength | Elongation (room temperature) | Peel strength (FR-4) |
| µm | Mpa | % | kN/m | |
| JTCSLC | 9 | 390 | 4 | 1.0 |
| 12 | 390 | 8 | 1.2 | |
| 18 | 390 | 12 | 1.4 | |
| JDLC | 12 | 400 | 6 | 1.1 |
CAC (Copper-Aluminum-Copper) Foil
- Copper foil attached to an aluminum shield by a peelable adhesive.
- Available with the copper foil attached either on one side or on both sides of the aluminum separator.
Features
- Contribute to higher yield by preventing contaminants causing denting or wrinkling during lay-up.
- More layers can be laid up comparing with stainless steel plate, thereby providing process cost savings.
Applications
- Printed circuit boards (mainly multi-layer boards)
Contact Information
From the Web
Inquiries accepted 24 hours a day.